Dispensing Machine SMT Red Glue Heat Curing
Tensan's SMT red glue is a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process.They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities. "Seal-glo NE series" not only have rapid curing properties, with a 1~2 minute heating duration between 90~150ºC, as required for SMD mounting, their fine properties enable them to be applied by both high speed dispensing and screen printing alike. We have a wide range and variety of grades to meet specific customer requirements
Features & Benefits of Red Glue
- REACH, ROHS certified
- Excellent thixotropy
- Good adhesive strength after curing
- Easy to mix and use
Typical Properties of Red Glue
| Property |
Unit |
TS4108A |
TS4109A |
| Specific gravity |
g/cm3 |
1.28 |
1.38 |
| Viscosity at 25ºC, 5rpm |
25ºC,5rpm |
300.000cps |
390.000cps |
Adhesive strength |
2125c |
44N(4.5kgf ) |
38N(3.9kgf ) |
| Mini-mold tr |
45N(4.6kgf ) |
38N(3.9kgf ) |
| SOP-IC 16P |
92N(9.4kgf ) |
92N(9.4kgf ) |
| Thixotropy index |
|
6.3 |
5.0 |
| Electric property |
Ω*cm |
2.6*1016 |
1.8*101 |
| resistance Insulation |
Ω*cm |
1.0*1014 |
3.4*1014 |
| ResistanceInitial value |
Ω*cm |
1.2*1012 |
2.1*1032 |
| Curing condition |
---- |
150ºC/60sec
130ºC/90sec |
150ºC/60sec
130ºC/90sec |
| Applying method |
---- |
High-speed dispenser |
Screen printing
Thick mask |
| Dielectric constant |
---- |
3.62/1MHz |
3.8(100K Hz) |
| Dielectric loss tangent |
---- |
0.013/1MHz |
0.027(100KHz) |
| Preservation condition |
---- |
Refrigerated storage at 2~10 ºC |
| Package style |
---- |
200G/30CC |
Instructions and Precautions of Red Glue
Cold storage, to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25ºC-30ºC can help improve the high-speed dispensing effect.
Precautions of Red Glue
- In order to avoid contaminating unused glue, any glue can not be back into the original packaging.
- Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing, do not put SMT printed circuit board in the air for too long, patch curing as soon as possible, if possible, air humidity should be controlled.
Packing Information
30ml/syringe
200g/syringe
