Dispensing Machine SMT Red Glue Heat Curing

Dispensing Machine SMT Red Glue Heat Curing

Model No.︰TS4108A

Brand Name︰Tensan

Country of Origin︰China

Unit Price︰US $ 1 / pcs

Minimum Order︰100 pcs

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Product Description

Dispensing Machine SMT Red Glue Heat Curing

Tensan's SMT red glue is a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process.They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities. "Seal-glo NE series" not only have rapid curing properties, with a 1~2 minute heating duration between 90~150ºC, as required for SMD mounting, their fine properties enable them to be applied by both high speed dispensing and screen printing alike. We have a wide range and variety of grades to meet specific customer requirements


Features & Benefits of Red Glue 

  1. REACH, ROHS certified
  2. Excellent thixotropy
  3. Good adhesive strength after curing
  4. Easy to mix and use


Typical Properties of Red Glue

Property Unit TS4108A TS4109A
Specific gravity g/cm3 1.28 1.38
Viscosity at 25ºC, 5rpm 25ºC,5rpm 300.000cps 390.000cps

Adhesive strength
2125c 44N(4.5kgf ) 38N(3.9kgf )
Mini-mold tr 45N(4.6kgf ) 38N(3.9kgf )
SOP-IC 16P 92N(9.4kgf ) 92N(9.4kgf )
Thixotropy index   6.3 5.0
Electric property Ω*cm 2.6*1016 1.8*101
resistance Insulation Ω*cm 1.0*1014 3.4*1014
ResistanceInitial value Ω*cm 1.2*1012 2.1*1032
Curing condition ---- 150ºC/60sec
130ºC/90sec
150ºC/60sec
130ºC/90sec
Applying method ---- High-speed dispenser Screen printing
Thick mask
Dielectric constant ---- 3.62/1MHz 3.8(100K Hz)
Dielectric loss tangent ---- 0.013/1MHz 0.027(100KHz)
Preservation condition ---- Refrigerated storage at 2~10 ºC
Package style ---- 200G/30CC


Instructions and Precautions of Red Glue
Cold storage, to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25ºC-30ºC can help improve the high-speed dispensing effect.

Precautions of Red Glue

  1. In order to avoid contaminating unused glue, any glue can not be back into the original packaging.
  2. Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing,  do not put SMT printed circuit board in the air for too long, patch curing as soon as possible, if possible, air humidity should be controlled.


Packing Information
30ml/syringe
200g/syringe

Payment Terms︰ TT

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